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International Conference on Thermal Interface Materials and Applications

ICTIMA

Sat, May 2, 2026- Sun, May 3, 2026

Osaka, Japan

About This Conference

The aim of the Conference is to provide a platform to the researchers and practitioners from both academia as well as industry to meet the share cuttingedge development in the field.

Call for Papers

thermal interface materials
heat transfer
thermal conductivity
thermal management
energy systems
system optimization
thermal analysis
process engineering
convective heat transfer
thermal design
heat exchangers
electronics cooling
thermal systems
material science
energy efficiency

Important Dates

Start Date

Saturday, May 2, 2026