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International Conference on Electronics Packaging and Assembly Engineering

IC-EPAE

Tue, Jun 30, 2026- Wed, Jul 1, 2026

Busan, South Korea

About This Conference

The aim of the Conference is to provide a platform to the researchers and practitioners from both academia as well as industry to meet the share cuttingedge development in the field.

Call for Papers

electronics packaging
assembly engineering
PCB design
microelectronics
VLSI
embedded systems
electronics engineering
signal processing
control systems
power electronics
thermal management
computational modeling
energy efficiency
testing and verification
system reliability
hardware optimization
device fabrication
energy materials
performance analysis
energy management